BARRIER LAMINATE, LID MATERIAL AND PACKAGE

Title:

BARRIER LAMINATE, LID MATERIAL AND PACKAGE

Document Type and Number:

Japanese Patent JP2023023639

Kind Code:

A

Abstract:

To improve gas barrier properties of a laminate having a barrier substrate having a vapor-deposition film on a stretched polypropylene film, and a sealant layer.SOLUTION: A barrier laminate contains a first substrate, a second substrate, and a sealant layer in a thickness direction in the stated order. One of the first and second substrates is a barrier substrate having a polypropylene resin layer and a vapor-deposition film, while the other of the first and second substrates is a polypropylene resin substrate. The polypropylene resin layer is a stretched layer. The vapor-deposition film is composed of inorganic oxide. The polypropylene resin substrate is a stretched substrate.SELECTED DRAWING: None

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Inventors:

FURUYA SHUNSUKE
KONO SHINICHIRO
SUZUKI FUMI
YAMATO YOHEI

Application Number:

JP2021129332A

Publication Date:

February 16, 2023

Filing Date:

August 05, 2021

Export Citation:

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Assignee:

DAINIPPON PRINTING CO LTD

International Classes:

B32B9/00; B32B7/027; B32B9/04; B32B27/32; B65D65/40

Attorney, Agent or Firm:

Nakamura Yukitaka
Miyajima Manabu
Asano Mari

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