Title:
高周波プリント配線板用基材
Document Type and Number:
Japanese Patent JP6997104
Kind Code:
B2
Abstract:
A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 µm, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.
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Inventors:
Kai Mori Shingo
Yamauchi Masaaki
Kentaro Okamoto
Satoshi Kitani
Kazuo Murata
Yamauchi Masaaki
Kentaro Okamoto
Satoshi Kitani
Kazuo Murata
Application Number:
JP2018557443A
Publication Date:
January 17, 2022
Filing Date:
June 20, 2018
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
Sumitomo Electric Print Circuit Co., Ltd.
International Classes:
H05K1/03; B32B15/08; B32B15/082; B32B15/20; C08K3/013; C08L27/12; H05K1/09; H05K3/38
Domestic Patent References:
| JP2016046433A | ||||
| JP2014175485A | ||||
| JP2002141630A | ||||
| JP5167211A | ||||
| JP2007314720A | ||||
| JP2013201344A |
Attorney, Agent or Firm:
Amano Kazunori