Title:
BEAM CUTTING-OFF METHOD
Document Type and Number:
Japanese Patent JP2005021897
Kind Code:
A
Abstract:
To provide a beam cutting-off method with which the yield can be improved so as not to float up chips onto a sheet.
When a prescribed shape from the metal sheet 10 is cut off by using a laser beam 20, the center point B of gravity in the shape to be cut off is sought, and the cut-off is started from the center point C of arc or the contacting point (edge point) D of both sides away from the center point B of the gravity as farther as possible so that the chips surely drop down.
Inventors:
HIRATANI SHINICHI
Application Number:
JP2003186600A
Publication Date:
January 27, 2005
Filing Date:
June 30, 2003
Export Citation:
Assignee:
SUMITOMO HEAVY INDUSTRIES
International Classes:
B23K26/38; (IPC1-7): B23K26/00
Attorney, Agent or Firm:
Satoshi Takaya
Tsuyoshi Makino
Keisuke Matsuyama
Tsuyoshi Makino
Keisuke Matsuyama
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