Title:
BINDER COMPOSITION FOR AQUEOUS CHIPPING RESISTANT COATING MATERIAL AND AQUEOUS CHIPPING COATING MATERIAL USING THE SAME COMPOSITION
Document Type and Number:
Japanese Patent JP3018146
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a binder composition comprising a specific resin latex and a vinyl polymer, free from sagging in drying even when thickly applied and excellent in blister resistance and chipping resistance of a coating film because of reversible heat-sensitive gelling property.
SOLUTION: This binder composition contains (A) a resin latex [e.g. a styrene-butadiene based resin, a polyurethane (urea) resin or a styrene-acrylic resin latex] containing 0.01mmol/g of radically polymerizable emulsifier having (meth)acryloyloxy [e.g. anionic (meth)acrylic acid esters] having (meth) acryloyloxy in liquid phase and (B) a vinyl polymer (e.g. a polymer containing ≥50wt.% vinylcarboxylic acid ester of an alkylene oxide adduct of a cyclic amine or a ≥5C noncyclic amine as an unit) capable of reversibly changing hydrophilic property and hydrophobic property at a definite temperature (e.g. 15-100°C).
Inventors:
Juro Shimada
Shunji Matsunaga
Tatsuya Ohsumi
Shunji Matsunaga
Tatsuya Ohsumi
Application Number:
JP6195896A
Publication Date:
March 13, 2000
Filing Date:
February 22, 1996
Export Citation:
Assignee:
SANYO CHEMICAL INDUSTRIES,LTD.
International Classes:
C09D5/00; C09D129/10; C09D133/14; C09D133/26; C09D201/00; (IPC1-7): C09D201/00; C09D5/00; C09D129/10; C09D133/14; C09D133/26
Domestic Patent References:
| JP275682A | ||||
| JP69848A | ||||
| JP81090A | ||||
| JP532938A | ||||
| JP925454A |
Other References:
【文献】特許2864222(JP,B2)