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Title:
基板処理装置、基板処理方法及びコンピュータ記憶媒体
Document Type and Number:
Japanese Patent JP7022589
Kind Code:
B2
Abstract:
A substrate treatment apparatus for applying a coating solution to a front surface of a substrate and developing an exposed coating film on the front surface of the substrate, includes a film forming unit configured to form a friction reducing film on a rear surface of the substrate before exposure processing, the friction reducing film reducing friction between the rear surface of the substrate and a holding surface for holding the rear surface of the substrate in the exposure processing.

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Inventors:
Teruhiko Kodama
Koichi Matsunaga
Application Number:
JP2018000416A
Publication Date:
February 18, 2022
Filing Date:
January 05, 2018
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/027; B05B7/16; B05B7/26; B05C9/04; B05C9/10; B05C9/12; G03F7/09; G03F7/20; G03F7/30; G03F9/00; H01L21/683
Domestic Patent References:
JP9186224A
JP2005116691A
JP2013191601A
JP2017069271A
Attorney, Agent or Firm:
Kanemoto Tetsuo
Koji Hagiwara
Naoki Ogita



 
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