Title:
基板処理装置
Document Type and Number:
Japanese Patent JP7007141
Kind Code:
B2
Abstract:
To provide a substrate processing device capable of recovering predetermined process liquid subjected to substrate treatment in a predetermined recovery tank.SOLUTION: Disclosed is a substrate processing device for supplying process liquid onto a surface of a substrate 12 to perform substrate processing. This processing device includes: a rotor part for holding the substrate; a drive motor 35 for rotating the rotor part; a nozzle 23 for supplying process liquid onto the surface of the substrate 12; a ring body 21 which is relatively rotatably provided to the rotor part having a radius of rotation which is longer than that of the substrate 12 retained by the rotor part; and a ring body rotation mechanism enabling rotation of the ring body 21 at a rotational speed different from a rotational speed of the substrate 12.SELECTED DRAWING: Figure 1
Inventors:
Furuya Masaaki
Application Number:
JP2017184635A
Publication Date:
January 24, 2022
Filing Date:
September 26, 2017
Export Citation:
Assignee:
Shibaura Mechatronics Co., Ltd.
International Classes:
H01L21/306; H01L21/304
Domestic Patent References:
| JP6310418A | ||||
| JP10270408A | ||||
| JP2015023138A | ||||
| JP2019057680A |
Foreign References:
| US20150037499 |
Attorney, Agent or Firm:
Masaki Higuchi