Title:
BONDED BODY AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2021187015
Kind Code:
A
Abstract:
To provide a bonded body capable of suppressing a decrease in bond strength, and a method for producing the bonded body.SOLUTION: A bumper member 20 includes: a bumper body 21 having a ridge part 24 that forms a ridge; and a fiber reinforced resin part 26 that extends along an outer surface of the ridge part 24 and covers the outer surface, and is adhesively fixed to the ridge part 24. The bumper body 21 is made of a metal material. The fiber reinforced resin part 26 is made of a fiber reinforced resin material having a larger coefficient of thermal expansion than that of the metal material.SELECTED DRAWING: Figure 1
Inventors:
SHIRATORI YUKI
Application Number:
JP2020092516A
Publication Date:
December 13, 2021
Filing Date:
May 27, 2020
Export Citation:
Assignee:
TOYOTA TEKKO KK
International Classes:
B29C70/70; B29C43/18; B29C43/36; B29C65/20; B29C70/10; B29C70/42; B32B5/12; B32B7/027; B60R19/04; F16B11/00
Attorney, Agent or Firm:
Toshiya Fujii