Title:
基板をボンディングするためのボンディング装置および方法
Document Type and Number:
Japanese Patent JP7320621
Kind Code:
B2
Abstract:
A bonding device has two chucks, two gas pressure regulators and a control unit. The chucks each have a holding surface with pressure ports fluidically connected to the respective gas pressure regulator. The control unit is electrically and/or wirelessly connected to the gas pressure regulators and configured to control gas pressure regulators independently from each other. Support elements movably mounted within the pressure ports, are provided to measure the amount of substrate deflection and adjust the respective gas pressures and also to apply additional mechanical pressure to the substrates. The two chucks may be mounted on corresponding support structures so as to be thermally isolated therefrom. The temperature of the two chucks may be equalised by moving the chucks into contact. A chuck tempering device may be used for equalising the temperature of the two chucks. The bonding device is used for bonding two substrates by bonding wave propagation.
Inventors:
Gregory, George
Application Number:
JP2021567847A
Publication Date:
August 03, 2023
Filing Date:
May 13, 2019
Export Citation:
Assignee:
Suss MicroTec Lithography GmbH
International Classes:
H01L21/60
Domestic Patent References:
| JP2018093018A | ||||
| JP2010267708A |
Foreign References:
| WO2017162272A1 |
Attorney, Agent or Firm:
Takuji Yamada
Yoshiyuki Maebori
Haruo Nakano
Yoshiyuki Maebori
Haruo Nakano