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Title:
TREATMENT APPARATUS
Document Type and Number:
Japanese Patent JP3177729
Kind Code:
B2
Abstract:

PURPOSE: To provide a treatment apparatus including a workpiece holder that has chemical resistance and durability.
CONSTITUTION: This is a treatment apparatus which includes a treatment tank 15 for containing a treatment solution in which a semiconductor wafer W is dipped, a wafer chuck 20 for holding and conveying the semiconductor wafer W to the treatment tank 15, and a wafer boat 30 for holding the semiconductor wafer W in the state where the semiconductor wafer W is dipped in the treatment solution in the treatment tank 15. Each of at least a semiconductor wafer W holder of the wafer chuck 20 and a semiconductor wafer W holder of the wafer boat 30 is formed with recilient stainless steel core materials 28a, 34a and synthetic resin cover layers 28b, 28c, 34b, 34c which cover outer surfaces of the core materials 28a, 34a and which have chemical resistance against the treatment solutions of different kinds. In this case, for the synthetic resin cover layer there is used any one of polytetrafluoroethylene, tetrafluoroethylene- perfluoroalkylvinyl ether copolymer or polyvinylidenee fluoride.


Inventors:
Yoshiyuki Honda
Application Number:
JP13874295A
Publication Date:
June 18, 2001
Filing Date:
May 12, 1995
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
B08B3/04; H01L21/304; H01L21/673; H01L21/68; (IPC1-7): H01L21/304; B08B3/04; H01L21/68
Domestic Patent References:
JP7231035A
JP60128623A
JP4130724A
JP4167542A
JP6204197A
JP745570A
JP7142433A
JP3172350A
JP5206256A
Attorney, Agent or Firm:
Kikuhiko Nakamoto