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Title:
BUNDLING DEVICE BY BAND
Document Type and Number:
Japanese Patent JPH05254511
Kind Code:
A
Abstract:

PURPOSE: To facilitate a bundling work of wires or the like by use of bundling bands and tools.

CONSTITUTION: A bundling tool B provided with a fitting part 4 of a band- bundling tool against a tool receiver A provided with a lock-off arm 1 against a flexible stopper 13 in an insertion chamber C1 of the band-bundling tool is transferably provided. And the stopper keeps the position at a part of the place where the band-bundling tool is fitted in the bundling tool B and the lock-off arm 1 forces the flexible stopper 13 to forcibly transfer to the non-fitting position against a band D to release retaining by a fixing means. Then the bundling tool B is shifted to the other position and the lock-off arm 1 releases the retaining of the flexible stopper 13.


Inventors:
Kenji Tsuchiya
Application Number:
JP5153092A
Publication Date:
October 05, 1993
Filing Date:
March 10, 1992
Export Citation:
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Assignee:
Yazaki Corporation
International Classes:
B65B27/00; (IPC1-7): B65B27/00
Attorney, Agent or Firm:
Hideo Takino (1 outside)



 
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