CAPACITY TYPE PRESSURE SENSOR

Japanese Patent JPH03239936

A

PURPOSE:To prevent a leak and to obtain stable performance by providing a seal member between a reference pressure chamber formed at the join part between both substrate and a circuit part. CONSTITUTION:The semiconductor substrate 11 and glass substrate 15 are joined together to constitute the capacity type pressure sensor 10 and the reference pressure chamber 14 is formed at the join part. Electrodes 13 and 17 are formed on both opposite surfaces of the reference pressure chamber 14 to form a pressure sensitive diaphragm part 12 which receives pressure P to be measured on the substrate 11, and the electrode 13 is provided on the diaphragm part 12 to the detects variation in the capacity between the electrodes 13 and 17 by the circuit part 21, thereby measuring the pressure. An electric conductor layer 18 and a circuit part 21 are formed on the substrate 11 and connected to the electrode 13, a hole part 24 is provided to the substrate 15 corresponding to the circuit part 21, and the seal member 25 made of soft metal is arranged at the periphery of the hole part 24 while surrounding the circuit part 21. Consequently, the substrates 11 and 15 are joined together and when the electrode 17 is connected to the circuit part 21 through the electric conductor layer 18, the member 25 is pressed, so a leak in the reference pressure chamber 14 at the part of the electric conductor layer 18 to the side of the hole part 24 is precluded to obtain the stable performance.

ISHIKAWA MINEO
SAKURAI TOMIKI
TERABE HIROAKI

JP3681090A

October 25, 1991

February 16, 1990

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TOYODA MACHINE WORKS LTD
JAPAN RES DEV CORP

G01L9/12; G01L9/00; (IPC1-7): G01L9/12

Fujitani Osamu

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