To provide by simple manufacture process a ceramic board which can prevent the dislocations in surface mounting parts caused by the effects of solder reflowing.

A ceramic board is manufactured by punching sheets of green sheets 1 in multilayer structure for the surface with a punched, according to the peripheral external form of surface mounting parts, thereby forming punched parts 2, and printing specified circuit wirings 3 at every green sheet 1, and stacking punching green sheets 1 at the surface part and green sheets 1 having circuit wirings 3 at the inner layer part, and baking them, and next, attaching surface mounting parts to the punched parts 2 by solder reflowing and electrically connecting them.