Title:
CERAMIC CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2007173577
Kind Code:
A
Abstract:
To provide a ceramic-metallic bonding circuit board which has a wax material overhanging part with a little failure such as an air gap or the like, and is excellent in reliability such as a thermal impact nature or the like.
A Cu phase or a Cu-In phase or an air gap of an area of ≥300 μm2 is one or less (including 0) in a cross section of 0.02 mm2 of an outwardly overhanging wax material rather than a side face of a copper circuit board formed on a ceramic circuit board, or an average area per each one of the Cu phase or the Cu-In phase or the air gap is 20 to 200 μm2.
Inventors:
FUJITA TAKU
IMAMURA TOSHIYUKI
WATANABE JUNICHI
IMAMURA TOSHIYUKI
WATANABE JUNICHI
Application Number:
JP2005370011A
Publication Date:
July 05, 2007
Filing Date:
December 22, 2005
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
H05K3/38; H01L23/13; H01L23/14
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