Title:
CERAMICS-METAL JUNCTION BOARD WITH HEAT AND IMPACT RESISTANCE
Document Type and Number:
Japanese Patent JP3281331
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a ceramics-metal junction board having heat and impact resistance and used reliably as an insulating circuit board for mounting a power device.
SOLUTION: A tough pitch copper plate 2 with a thickness of 0.25 mm on a circuit side a tough pitch copper plate 2 with a thickness of 0.2 mm on a heat-sink side, and a conventional aluminum 22 mm square board as a ceramic member are prepared. The copper plate 2 is put in contact with the main face of the aluminum board 1 and heated and cooled under an atmosphere with inert gas to form a junction body. One copper face plate 2 on the circuit side in the junction body is formed into a given patterned shape with an uneven pattern with an edge width of 0.3 mm, an interval of 0.25 mm, and a length of 0.5 mm. Then, the heat-sink side of the junction body is etched into the same pattern as the copper plate 2 on the circuit side.
Inventors:
Masami Kimura
Ning Xiaoshan
Tetsuo Furihata
Ning Xiaoshan
Tetsuo Furihata
Application Number:
JP17934299A
Publication Date:
May 13, 2002
Filing Date:
December 11, 1991
Export Citation:
Assignee:
DOWA MINING CO.,LTD.
International Classes:
H01L23/12; H01L23/373; H05K1/02; (IPC1-7): H01L23/373; H01L23/12; H05K1/02
Domestic Patent References:
| JP5167205A | ||||
| JP61296788A | ||||
| JP4343287A | ||||
| JP1120886A |
Attorney, Agent or Firm:
Masahiko Maruoka