Title:
面取り加工方法
Document Type and Number:
Japanese Patent JP7166794
Kind Code:
B2
Abstract:
To provide a chamfering method capable of efficiently chamfering the outer periphery of a wafer. A chamfering method at least includes the following steps: a rough machining step for positioning a light-condensing point of a laser beam at the outer periphery of a wafer to irradiate the wafer with the laser beam, and roughly performing chamfering by ablation; and a finish machining step for using a grinding stone to grind the outer periphery of the wafer that has been subjected to the ablation processing to perform finish machining.
More Like This:
Inventors:
Kazuya Hirata
Application Number:
JP2018107872A
Publication Date:
November 08, 2022
Filing Date:
June 05, 2018
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/304; B23K26/36; B24B9/00
Domestic Patent References:
| JP2004111606A | ||||
| JP2014229843A | ||||
| JP2012101327A | ||||
| JP2018056347A |
Foreign References:
| WO2009157319A1 | ||||
| US20180057390 |
Attorney, Agent or Firm:
Naozumi Ono
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Okunuki Sachiko
Tsuyoshi Tsukano
Yoshifumi Kaneko
Previous Patent: game machine
Next Patent: RIBBON SPIRAL DEVICE FOR SUPPORTING MEDIUM SMALL BORE PIPE JACKING METHOD
Next Patent: RIBBON SPIRAL DEVICE FOR SUPPORTING MEDIUM SMALL BORE PIPE JACKING METHOD