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Title:
半導体ウェーハ用チャックテーブル及び半導体ウェーハの加工方法
Document Type and Number:
Japanese Patent JP5361634
Kind Code:
B2
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Inventors:
Satoshi Odashima
Application Number:
JP2009219951A
Publication Date:
December 04, 2013
Filing Date:
September 25, 2009
Export Citation:
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Assignee:
Shin-Etsu Polymer Co., Ltd.
International Classes:
B23Q3/08; H01L21/301; H01L21/683
Domestic Patent References:
JP5285761A
JP9036599A
JP2001246727A
JP2002170857A
JP2007036101A
JP2012524984A
JP63132434U
Attorney, Agent or Firm:
Eisuke Fujimoto
Masayoshi Kanda
Akio Miyao
Nobuyuki Baba



 
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