To provide a circuit board composition having a physical property of excellent high temperature resistance and stability of 600 sec or more in a solder oven at 288°C after subjected to the autoclave test for 0.5 hr, to provide a circuit board achieving peel strength of 10 lbf/inch or more even using an ordinary 1 oz copper foil, to provide a circuit board having a lower moisture absorption rate than a copper foil substrate generally used currently, and further to provide a circuit board of flame-resistant composition which reaches UL94 V-0 flame resisting standard even with a low bromine content.
The circuit board resin composition comprises (A) a halogen epoxy resin including a modified oxazolidone obtained by mixing a halogen epoxy resin with a catalyst of a quaternary ammonium salt and by reacting with an isocyanate, (B) an epoxy resin including two or more epoxy groups, (C) a curing agent, and (D) a curing accelerator.
CHIANG JUNG-CHUNG
WEI WEN-LUNG
LU JUNG-CHE
| JPH08259786A | 1996-10-08 | |||
| JPH06322061A | 1994-11-22 | |||
| JP2003119253A | 2003-04-23 | |||
| JPH0543655A | 1993-02-23 |
Masakazu Takahashi
Tomokazu Takahashi