To provide a lightweight Japanese lacquer resin composition which has preferable heat insulation property and can be provided for substrate process of Japanese lacquer coating in place of substrate material of the traditional Japanese lacquer coating, and to provide a Japanese lacquer resin molding serving as a base material by using a Japanese lacquer resin itself with respect to commodity such as flatware made by subjecting a resin base material prepared by mixing a synthetic resin, wooden powder, etc. to the Japanese lacquer coating.

The substrate material of the Japanese lacquer coating which has light weight and has preferable heat insulation property is made by using the Japanese lacquer resin composition prepared by compounding hollow glass beads having an average particle size of 10 to 80 μm to a Japanese lacquer resin. Further, a foamed resin molding using Japanese lacquer can be provided by foaming and curing the Japanese lacquer resin composition at a temperature of 80 to 200°C.