Title:
CIRCUIT BOARD PACKAGING STRUCTURE OF MULTIFUNCTIONAL VIBRATION ACTUATOR
Document Type and Number:
Japanese Patent JP2005026337
Kind Code:
A
Abstract:
To make a multifunctional vibration actuator into packaging fixed on a surface of a circuit board by solder reflow without exposing weakly heat-resistant components such as diaphragm, magnet and voice coil to elevated temperature of a reflow tub.
In the circuit board packaging structure of a multifunctional vibration actuator 1, a bracket is fixed by solder reflow on the surface of the circuit board. By mounting housing of the actuator on the bracket 3, the system is configured such that terminals of the actuator are connected electrically with electrodes 18, 19 of the circuit board and the actuator is mounted on the surface of the circuit board.
Inventors:
UENO KENJI
UEDA MINORU
FUJIMORI FUMIO
UEDA MINORU
FUJIMORI FUMIO
Application Number:
JP2003188011A
Publication Date:
January 27, 2005
Filing Date:
June 30, 2003
Export Citation:
Assignee:
NAMIKI PRECISION JEWEL CO LTD
International Classes:
H05K1/18; H02K5/22; H02K33/18; H05K3/30; (IPC1-7): H05K1/18
Domestic Patent References:
| JP2002291197A | 2002-10-04 | |||
| JP3363792B2 | 2003-01-08 | |||
| JPH10136608A | 1998-05-22 | |||
| JP2003088806A | 2003-03-25 | |||
| JP2003154315A | 2003-05-27 | |||
| JP2001339926A | 2001-12-07 | |||
| JP2002126644A | 2002-05-08 |