Title:
CIRCUIT CONNECTING MATERIAL
Document Type and Number:
Japanese Patent JP2011184528
Kind Code:
A
Abstract:
To provide a circuit connecting material compatible with fast curing property and adhesion and connecting a circuit for a short time.
The circuit connecting material is prepared by dispersing conductive particles in an adhesive composition containing following (1)-(4) components, which are (1) a phenoxy resin, (2) an alkylene oxide-modified bisphenol A type epoxy resin, (3) an acrylic particle having a core shell structure and (4) a latent curing agent.
Inventors:
KOBAYASHI TAKANOBU
SAKANO KAZUE
KOBAYASHI KOJI
SAKANO KAZUE
KOBAYASHI KOJI
Application Number:
JP2010049647A
Publication Date:
September 22, 2011
Filing Date:
March 05, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J163/02; C09J7/00; C09J9/02; C09J11/06; C09J133/00; C09J151/00; C09J171/10; H01B1/22; H01L21/60; H01R11/01; H05K1/14; H05K3/32
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu
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