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Title:
METHOD OF FORMING OVERLAPPING PART
Document Type and Number:
Japanese Patent JP2011184529
Kind Code:
A
Abstract:

To ensure sealing performance against displacement of a bonded part due to a mechanical load while using a simplified step.

The casting material surfaces 1,2 of the first work piece W1 formed by casting is irradiated with plasma to modify a coating agent for a mold (a mold release agent, an antibaking agent, etc.) adhered on the casting material surface, forming an active surface with excellent adhesion properties. The polymer material 4, as an adhesive or a sealing material, is applied onto the plasma-irradiated area of the first work piece W1. Modification of the casting material surface of the first work piece can enhance adhesion properties of the polymer material, and prevents the intercalated polymer material 4 from being easily delaminated when the second work piece W2 overlaps with the first work piece W1. A chamfered area 2 is formed adjacent to the bonded surface 1 of the first work piece W1. Plasma irradiation enhances adhesion strength of the polymer material 4 to the chamfered area 2, thereby ensuring liquid-sealing without causing delamination of the polymer material 4 upon displacement of the bonded part of the work pieces due to mechanical load.


Inventors:
HAYAKAWA TOMOYA
MIYAJIMA TOSHIKI
MASUJIMA MASAHIRO
Application Number:
JP2010049817A
Publication Date:
September 22, 2011
Filing Date:
March 05, 2010
Export Citation:
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Assignee:
HONDA MOTOR CO LTD
International Classes:
C09J5/02; F16J15/14
Domestic Patent References:
JP2005330296A2005-12-02
JPH08138774A1996-05-31
JP2007326145A2007-12-20
JP2007253204A2007-10-04
JP2000240795A2000-09-05
Attorney, Agent or Firm:
Yoshihito Iizuka
Hideo Hayashi
Ryohei Kaizuka