CIRCUIT UNIT AND METHOD FOR MANUFACTURING THE SAME

Title:

CIRCUIT UNIT AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

Japanese Patent JP2013179299

Kind Code:

A

Abstract:

To provide a circuit unit capable of improving a positional accuracy and a method for manufacturing the same.

The circuit unit comprises a first conductive member 22 and a second conductive member 32 which is laminated on the first conductive member 22 via an insulating first resin member. A first engaging part 31, which makes positioning between a lower die 40 and the first conductive member 22 by penetrating a first positioning member 42 of the lower die 40, is formed on the first conductive member 22. A second engaging part 36, which makes positioning between the lower die 40 and the second conductive member 32 by engaging the lower die 40 in a position that overlaps the first engaging part 31 in relation to the direction of the first engaging part 31 penetrating the first positioning part 42 in a state of being laminated on the first conductive member 22, is formed on the second conductive member 36.

More Like This:

JPS60229398	METHOD OF SOLDERING BASE MATERIAL
JP2001068804	ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND ITS MANUFACTURE, AND COPPER PLATED LAMINATE PROVIDED THEREWITH
WO/2006/040088	DRILLING DEVICE FOR DRILLING CONTACT HOLES FOR ASSEMBLING CONTACT SURFACES OF A MULTILAYER CIRCUIT BOARDS

Inventors:

CHIN NOBORU
FUKUYAMA MINORU
YAMANE SHIGEKI
MAEDA HIROTOSHI
MIZUNO TAKEHIRO

Application Number:

JP2013048841A

Publication Date:

September 09, 2013

Filing Date:

March 12, 2013

Export Citation:

Click for automatic bibliography generation Help