Title:
CLEANING METHOD OF WIRING BOARD, AND MANUFACTURING METHOD OF LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP2006253053
Kind Code:
A
Abstract:
To provide a cleaning method of a wiring board capable of effectively remove foreign matters (contamination) existing on a substrate on which an electrode is patterned, and a manufacturing method of a light emitting device.
This method is to clean the wiring board 70 in which the electrode 23 is disposed on the substrate 20, and to remove the foreign matters on the electrode 23 by using an etching liquid. An alkali etching liquid can be used as the etching liquid. For example, a solution containing potassium hydroxide, tetramethyl ammonium hydroxide, or the like is used as the etching liquid.
Inventors:
HOSODA TOSHIKO
Application Number:
JP2005070494A
Publication Date:
September 21, 2006
Filing Date:
March 14, 2005
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05B33/10; H01L51/50; H05B33/02
Attorney, Agent or Firm:
Masahiko Ueyanagi
Fujitsuna Hideyoshi
Osamu Suzawa
Fujitsuna Hideyoshi
Osamu Suzawa