Title:
COATING DEVICE AND COATING METHOD
Document Type and Number:
Japanese Patent JP3410342
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily form a coating film having a uniform and desired thickness on a surface of a substrate to be treated with a treating liquid by promptly feeding a second mixed liquid in which the concentration of the treating liquid is high to the substrate to be treated, after a first mixed liquid containing a solvent in a relatively large quantity is fed to the substrate to be treated.
SOLUTION: A resist/thinner mixed liquid containing the thinner in a relatively large quantity is fed from a resist nozzle 86 to a surface of a wafer W through a discharge valve 77 and a resist feed pipe 88. Subsequently the feed of the thinner to a poststage joint valve 75b is stopped and the resist/thinner mixed liquid with a high resist concentration which is mixed with a prestage static mixer 76a, as it is, is discharged from the poststage joint valve 75b, is introduced into a poststage static mixer 76b and is fed from the resist nozzle 86 to the surface of the wafer W through the discharge valve 77 and the resist feed pipe 88.
Inventors:
Takahiro Kitano
Katsuya Okumura
Shinichi Ito
Katsuya Okumura
Shinichi Ito
Application Number:
JP27012597A
Publication Date:
May 26, 2003
Filing Date:
October 02, 1997
Export Citation:
Assignee:
東京エレクトロン株式会社
株式会社東芝
株式会社東芝
International Classes:
G03F7/16; B05C11/08; B05D1/36; B05D1/40; G05D11/13; H01L21/00; H01L21/027; (IPC1-7): B05C11/08; B05D1/40; G03F7/16; H01L21/027
Domestic Patent References:
| JP1173719A | ||||
| JP738234A | ||||
| JP63226928A | ||||
| JP61188351U |
Attorney, Agent or Firm:
Saichi Suyama
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