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Title:
COATING LIQUID FOR ELEMENT ISOLATION MATERIAL AND METHOD FOR PREPARING THE SAME, THIN FILM FOR ELEMENT ISOLATION LAYER AND METHOD FOR FORMING THE SAME, AND SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2011114163
Kind Code:
A
Abstract:

To provide a coating film for element isolation material which hardly generates peeling between a substrate and an element isolation layer or cracks thereof and can form a flat element isolation layer on a substrate having a concave groove.

The coating liquid for element isolation material which is used to form an element isolation layer having a shallow trench isolation structure of a semiconductor device includes an insulating film forming precursor in which an alkoxysilane compound is hydrolyzed and condensed and a solvent for preparing the concentration of the insulating film forming precursor at a desired concentration. The insulating film forming precursor is a polymer having repeating units of (Si-O) as a main skeleton, and has an alkoxy group of 2-6C on the terminal of its molecule.


Inventors:
BANBA AKINORI
KOIKE TADASHI
MANABE NOBUYUKI
Application Number:
JP2009269325A
Publication Date:
June 09, 2011
Filing Date:
November 26, 2009
Export Citation:
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Assignee:
UBE NITTO KASEI CO
International Classes:
H01L21/316; H01L21/76
Domestic Patent References:
JPH08130247A1996-05-21
JP2006310448A2006-11-09
JP2002289681A2002-10-04
JPH11181095A1999-07-06
JP2001261972A2001-09-26
JP2008159683A2008-07-10
JP2006336002A2006-12-14
JP2001210633A2001-08-03
JP2006303129A2006-11-02
JP2005320412A2005-11-17
JP2005183697A2005-07-07
JP2004006890A2004-01-08
Foreign References:
WO2009022719A12009-02-19
Attorney, Agent or Firm:
Kimura Mitsuru
Takanori Mamoru



 
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