Title:
複合ナノ粒子組成物およびアセンブリ
Document Type and Number:
Japanese Patent JP7390001
Kind Code:
B2
Abstract:
Composite nanoparticle compositions and associated nanoparticle assemblies are described herein which, in some embodiments, exhibit enhancements to one or more thermoelectric properties including increases in electrical conductivity and/or Seebeck coefficient and/or decreases in thermal conductivity. In one aspect, a composite nanoparticle composition comprises a semiconductor nanoparticle including a front face and a back face and sidewalls extending between the front and back faces. Metallic nanoparticles are bonded to at least one of the sidewalls establishing a metal-semiconductor junction.
Inventors:
Carol, David El.
Dan, ciao ciao
hewitt, cory
Summers, Robert
Dan, ciao ciao
hewitt, cory
Summers, Robert
Application Number:
JP2019543940A
Publication Date:
December 01, 2023
Filing Date:
February 16, 2018
Export Citation:
Assignee:
Wake Forest University
International Classes:
B82Y30/00; H10N10/852; B82Y40/00; H10N10/01
Domestic Patent References:
| JP2007307702A | ||||
| JP2004299011A | ||||
| JP2015502658A | ||||
| JP2014022731A | ||||
| JP2016534562A | ||||
| JP2014195073A | ||||
| JP2015528208A | ||||
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| JP2010245299A | ||||
| JP2013074051A | ||||
| JP2012146928A | ||||
| JP2012104560A | ||||
| JP2011146644A |
Foreign References:
| US20130269739 | ||||
| US20110100409 | ||||
| WO2012087660A2 | ||||
| WO2016156265A1 | ||||
| US20130234375 | ||||
| US20160308107 |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Masakazu Ito
Hiroko Hara
Kazushi Obuchi
Masakazu Ito
Hiroko Hara
Kazushi Obuchi
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