Title:
COMPONENT HOLDING TOOL
Document Type and Number:
Japanese Patent JP2021174853
Kind Code:
A
Abstract:
To provide a component holding tool that can hold a component with an adhesive layer and can be easily removed without applying excessive pressure to the component.SOLUTION: A component holding tool 10 includes a substrate 11 and an adhesive layer 12 provided on at least one main surface of the substrate 11, and the adhesive layer 12 is a silicone rubber sponge and has a skin layer on the surface. The silicone rubber sponge is made by vulcanizing and foaming a silicone rubber composition containing unvulcanized silicone rubber, an adhesive, and heat-expandable microcapsules.SELECTED DRAWING: Figure 1
Inventors:
SHIBAZAKI ARISU
Application Number:
JP2020076933A
Publication Date:
November 01, 2021
Filing Date:
April 23, 2020
Export Citation:
Assignee:
SHINETSU POLYMER CO
International Classes:
H01G13/00; B32B5/18; B32B25/20; B32B27/00; C09J5/08; C09J7/38; C09J183/04; C09J183/05; C09J183/07
Attorney, Agent or Firm:
Sakamoto International Patent and Trademark Office
Previous Patent: Semiconductor light emitting device
Next Patent: High frequency module and communication equipment
Next Patent: High frequency module and communication equipment