Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
COMPONENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JPH05198987
Kind Code:
A
Abstract:

PURPOSE: To discharge an electronic component quickly and properly by a method wherein a nozzle, for discharge use, which detects the component holding state of a nozzle for holding use and one end side of which is connected to a vacuum-pressure generation mechanism is installed in such a way that the other end is faced with the component held by the nozzle for holding use.

CONSTITUTION: A vacuum-pressure sensor 13 installed at a vacuum-pressure generation mechanism 11 for suction use detects a pressure inside a suction nozzle 8; it outputs the pressure to a controller 14; it checks whether an electronic component 12 is sucked or not in a proper state. A support utensil 15 is attached to the side part of a head 7; a nozzle 16, for discharge use, through which the electronic component 12 can be passed is installed so as to pass a hole in the support utensil 15. A vacuum-pressure generation mechanism 18, for discharge use, which is provided with a discharge part and with a vacuum generation valve 17 for discharge use is connected to one end side of the nozzle 16 for discharge use. The other end side is set so as to face the electronic component 12 which has been sucked to the nozzle 8 for suction use; an internal pressure is reduced by the actuation of the vacuum generation valve 17 for discharge use; the electronic component 12 is inhaled and discharged.


Inventors:
SAISAKA NORIAKI
Application Number:
JP2891492A
Publication Date:
August 06, 1993
Filing Date:
January 20, 1992
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOKICO LTD
International Classes:
B23P21/00; H05K13/04; H05K13/08; (IPC1-7): B23P21/00; H05K13/04; H05K13/08
Attorney, Agent or Firm:
Nobuo Kaida (2 outside)



 
Previous Patent: JPS5198986

Next Patent: 半導体装置の製造方法