To provide a component mounting device which has no risk of cracking a collected component or damaging a transfer head even if the work for withdrawing the collected component in a component collection tray is forgotten, and to provide a component collection method of the component mounting device.
The component mounting device includes a controller 60 for controlling the operation of a transfer head 5 such that the components P picked up by the transfer head 5, decided to be unsuitable for mounting and collected before mounting on the substrate 3 are not only arranged and mounted on a component collection tray 50a but also mounted in specified arrangement sequentially from a reference position 73 set on the component collection tray 50a, and a space detection means (a mark 74 and a substrate camera 67) for detecting whether the reference position 73 is free space or not when the collected component P is mounted at the reference position 73. If the reference position 73 detected by the free space detection means is free space, the controller 60 mounts the collected component P on the component collection tray 50a.
KAWASE TAKEYUKI
| JP2004179598A | 2004-06-24 | |||
| JPH03133802A | 1991-06-07 |
Hiroki Naito
Daisuke Nagano