Title:
COMPONENT MOUNTING METHOD AND ITS APPARATUS
Document Type and Number:
Japanese Patent JP2005243668
Kind Code:
A
Abstract:
To provide a component mounting method and its apparatus which can prevent a detection error when detecting the deviation of a substrate holding position and a component sucking position by vibration from predetermined ones.
The moved position of a mounting head 8 positioned at a positional deviation detecting position is measured. The measured value is corrected by a correction factor which is set in advance based on the vibration. Using the corrected value, a positioning correction operation of a suction nozzle 3 moved to a component mounting position on a substrate 6 is corrected based on the detection of the positional deviation.
Inventors:
TAKANO TAKESHI
YAMAUCHI TOSHIAKI
EGUCHI SHINZO
KITAGAWA HIROMOTO
YAMAUCHI TOSHIAKI
EGUCHI SHINZO
KITAGAWA HIROMOTO
Application Number:
JP2004047296A
Publication Date:
September 08, 2005
Filing Date:
February 24, 2004
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H05K13/04; (IPC1-7): H05K13/04
Attorney, Agent or Firm:
Masaru Ishihara