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Title:
COMPOSITE MULTILAYER BOARD AND MODULE USING IT
Document Type and Number:
Japanese Patent JP2002111226
Kind Code:
A
Abstract:

To provide a composite multilayer board that can be thinned, can secure strength, and can incorporate important components, and to provide a module using the composite multilayer board.

Resin 4, or a glass cloth layer 5 where glass cloth 2 is buried into a composite material obtained by mixing functional powder 3 into the resin 4 is provided at either of the upper and lower outermost layers. A cavity is formed in the multilayer board made of a glass cloth layer having the resin 4 or a glass clothless layer 12 that is made of a composite material where the functional powder 3 is mixed into the resin 4, and the glass clothless layer at a layer other than the glass cloth layer 5, and semiconductor components and chip components are mounted on the cavity for accommodation.


Inventors:
TAKATANI MINORU
TAKAHARA MASASHI
ENDO TOSHIICHI
Application Number:
JP2000292486A
Publication Date:
April 12, 2002
Filing Date:
September 26, 2000
Export Citation:
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Assignee:
TDK CORP
International Classes:
H05K3/46; H01L23/36; H01L25/00; (IPC1-7): H05K3/46; H01L23/36; H01L25/00
Domestic Patent References:
JPH11186677A1999-07-09
JPH06196866A1994-07-15
JPH11214851A1999-08-06
JPH1074858A1998-03-17
JPH11192620A1999-07-21
JP2001244368A2001-09-07
Attorney, Agent or Firm:
Shoichi Wakata



 
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