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Patent Searching and Data


Title:
CONDUCTIVE COMPOSITION, WATER-RESISTANT CONDUCTOR AND METHOD FOR FORMING THE SAME
Document Type and Number:
Japanese Patent JP2005272638
Kind Code:
A
Abstract:

To develop a conductive composition developing high conductivity without depending to humidity and excellent in a film-forming property, formability, transparency, adhesiveness, hardness and water resistance.

The conductive composition comprises (a) a water-soluble conductive polymer having a sulfonic acid group and/or a carboxyl group, (b) a solvent of a water-soluble conductive polymer and (c) a compound having a carbodiimide group as essential components. The conductive composition retains characteristics of the water-soluble conductive polymer, and in the conductive composition, characteristics such as water resistance and adhesive to the substrate which are weak points of the water-soluble conductive polymer are improved.


Inventors:
UZAWA MASASHI
SAITO YOSHIKAZU
MAEDA SHINICHI
Application Number:
JP2004087861A
Publication Date:
October 06, 2005
Filing Date:
March 24, 2004
Export Citation:
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Assignee:
MITSUBISHI RAYON CO
International Classes:
C08J7/04; C08K5/29; C08L101/02; C08L101/12; H01B1/20; H01B5/14; H01B13/00; (IPC1-7): C08L101/12; C08J7/04; C08K5/29; C08L101/02; H01B1/20; H01B5/14; H01B13/00
Attorney, Agent or Firm:
Toshio Yoshizawa
Nobuo Kawakami