To provide a conductive copper paste having a novel structure, which need not use a thermosetting resin component nor glass frit for keeping the adhesion with a base layer and an electrical contact with the base layer, and which is suitable for manufacture of a thick conductor layer.
The conductive copper paste is prepared by evenly mixing copper powder, fine copper powder, and a copper salt of aliphatic monocarboxylic acid dissolved in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent, or prepared by evenly mixing copper powder, fine copper powder, and copper nano particles dispersed in (dialkyl amino)alkylamine together with aliphatic polyhydric alcohol as a dispersion solvent. Use of the conductive copper paste allows the manufacture of a sintered compact layer exhibiting a good electrical conductivity.
UEDA MASAYUKI
HOSOYA KAZUO
HAMADA TAKESHI
MATSUBA YORISHIGE
| JP2009299086A | 2009-12-24 | |||
| JP2007018884A | 2007-01-25 | |||
| JP2005183144A | 2005-07-07 | |||
| JP2007083288A | 2007-04-05 | |||
| JPH08199096A | 1996-08-06 |
| WO2006011180A1 | 2006-02-02 | |||
| WO2004103043A1 | 2004-11-25 | |||
| WO2005037465A1 | 2005-04-28 |
Ishibashi Masayuki
Masaaki Ogata