To provide a manufacturing method for manufacturing a conductive film with excellent transparency and conductivity and an arbitrary pattern structure in which the film can be made to have a large area with a simple manner.
In a conductive film manufacturing method, a pattern structure (C) is formed with a conductive particle (P) near a contact point to a mold (B) on a substrate (A) by developing and drying fluid dispersion (D) of the conductive particles (P) on a surface of the substrate (A) on which the mold (B) having an opening with a net structure is arranged, and then the mold (B) is remove from the substrate (A). A monomer composition (X) or a resin composition (Y) is applied on the surface of the substrate (A) having the pattern structure (C), and a substrate (E) is arranged thereon to form a resin layer. The substrate (E) is exfoliated from the substrate (A), so as to transfer the pattern structure (C) on the surface of the substrate (E). Then, a photoresist is applied on the substrate (E) on which the pattern structure (C) is transferred, so as to provide an arbitrary pattern structure (F) to the pattern structure (C) on the surface of the substrate (E) by a photolithography method.
KAKE SHINJI
Takashi Ishida
Tetsuji Koga
Satoshi Deno
Nagasaka Tomoyasu
Yoshihiro Kobayashi
Next Patent: CONDUCTIVE FILM MANUFACTURING METHOD