Title:
導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
Document Type and Number:
Japanese Patent JP6956221
Kind Code:
B2
Abstract:
To provide a conductive particle capable of suppressing aggregation of conductive particles, and lowering a connection resistance, when connecting electrically each electrode.SOLUTION: A conductive particle according to the present invention includes a base material particle, a first conductive part arranged on the surface of the base material particle, and a second conductive part arranged on the outer surface of the first conductive part, in which the second conductive part contains ruthenium, and 50% or more of the surface area of the outer surface of the first conductive part is covered with the second conductive part.SELECTED DRAWING: Figure 1
Inventors:
Masao Sasahira
Application Number:
JP2020056063A
Publication Date:
November 02, 2021
Filing Date:
March 26, 2020
Export Citation:
Assignee:
Sekisui Chemical Co.,Ltd.
International Classes:
H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01
Domestic Patent References:
| JP2015197955A | ||||
| JP6684052B2 |
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office
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