Title:
Conductive paste and the heat dissipation board using this
Document Type and Number:
Japanese Patent JP6211948
Kind Code:
B2
Inventors:
Kazuhiro Okuda
Application Number:
JP2014020673A
Publication Date:
October 11, 2017
Filing Date:
February 05, 2014
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
H01B1/22; B32B18/00; C09D1/00; C09D5/24; C09D7/12; H01B5/14
Domestic Patent References:
| JP2012109148A | ||||
| JP2011070798A | ||||
| JP2013258128A | ||||
| JP2015086090A |
Attorney, Agent or Firm:
Makoto Abe
Michiko Oi
Michiko Oi
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