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Title:
CONDUCTIVE PASTE
Document Type and Number:
Japanese Patent JPH10162647
Kind Code:
A
Abstract:

To provide a conductive paste with excellent softness and high migration resistance.

This paste comprises a conductive power and a binder resin. In this case, the conductive powder is a copper alloy powder having silver concentration higher in the particle surface than the average silver concentration and the binder resin contains one or more thermoplastic resin selected from polyester resin, polyurethane resin, vinyl acetate resin, poly vinyl butyral resin.


Inventors:
OTANI AKIRA
MATSUDA HIDEKI
Application Number:
JP31773196A
Publication Date:
June 19, 1998
Filing Date:
November 28, 1996
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
C09D5/00; C09D5/24; C09D7/12; C09D129/14; C09D131/04; C09D167/02; C09D175/04; H01B1/22; (IPC1-7): H01B1/22; C09D5/00; C09D5/24; C09D7/12; C09D129/14; C09D131/04; C09D167/02; C09D175/04