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Title:
CONDUCTIVE PRECOATED ALUMINUM ALLOY PLATE
Document Type and Number:
Japanese Patent JP2013056441
Kind Code:
A
Abstract:

To provide a conductive precoated aluminum alloy plate which is excellent in ablation resistance, easy in mold workability, and displays excellent conductivity.

The conductive precoated aluminum alloy plate 1 consists of a substrate 2 consisting of aluminum or an aluminum alloy, a formed film 3 formed on one side or both sides thereof, and a conductive coat 4 formed thereon. The conductive coat 4 consists of a silicate, urethane resin, colloidal silica, surfactant and wax, and also the thickness T of the coat is ≥0.05 μm and ≤1.0 μm. The silicate is at least one selected from lithium silicate, sodium silicate, potassium silicate and ammonium silicate. The urethane resin is an aliphatic ester type or an aliphatic ester-ether type, and the glass transition point is ≥90°C and ≤150°C.


Inventors:
HATSUNO KEIICHIRO
Application Number:
JP2011195237A
Publication Date:
March 28, 2013
Filing Date:
September 07, 2011
Export Citation:
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Assignee:
SUMITOMO LIGHT METAL IND
International Classes:
B32B15/08; B32B15/095; C09D1/02; C09D5/24; C09D7/12; C09D175/04; C09D191/06; C23C28/00
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office