Title:
CONDUCTIVE TAPE AND ALUMITE TREATING METHOD
Document Type and Number:
Japanese Patent JP3963749
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a conductive tape easily stuck to a metallic plate or the like to enable to pass current and capable of being used for alumite treatment and an alumite treatment method easily performed at a suppressed cost using the conductive tape.
SOLUTION: The conductive tape is constituted so that a chemical resistant adhesive layer 11 is provided on one surface of a conductive body layer 10, conductive particles 12 each having a particle diameter smaller than the thickness of the adhesive layer 11 are dispersed in the adhesive layer 11 and the adhesive layer 11 side is stuck to an objective material 2 and pressed to conduct current to the conductive body layer 10 and the objective material 2 through the conductive particles 12. The alumite treatment method is performed by sticking the conductive tape 1 to an objective material 2 to be alumite-treated and pressing and applying voltage to the objective material 2 through the conductive layer 10.
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Inventors:
Toshio Kawate
Application Number:
JP2002083711A
Publication Date:
August 22, 2007
Filing Date:
March 25, 2002
Export Citation:
Assignee:
Kawate Co., Ltd.
International Classes:
C25D11/04; C25D17/12; (IPC1-7): C25D11/04
Domestic Patent References:
| JP11080682A | ||||
| JP2001345530A | ||||
| JP1121959U | ||||
| JP62046640U | ||||
| JP59003902A |
Attorney, Agent or Firm:
Takahisa Sato