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Title:
制御装置、基板処理システム、および制御方法
Document Type and Number:
Japanese Patent JP7098072
Kind Code:
B2
Abstract:
A control device (200) according to an embodiment comprises: an acquisition unit (210); a selection unit (213); a calculation unit (215); and a setting unit (216). The acquisition unit (210) acquires, from a plurality of substrate processing devices (100), processing schedules of the substrate processing devices (100) with respect to substrates. The selection unit (213) selects, on the basis of priority levels of the plurality of substrate processing devices (100), a scheduled-start substrate processing device (100) which is scheduled to start a processing schedule with respect to a new substrate. The calculation unit (215) calculates the total value of the effort expended in a processing schedule for which processing has started, and the effort to be expended in a scheduled-start processing schedule, which is the processing schedule that is to be newly started by the scheduled-start substrate processing device (100). The setting unit (216) sets the timing to start the scheduled-start processing schedule so that, if the total value is greater than a given upper limit value, said total value does not exceed the given upper limit value.

Inventors:
Takafumi Tsuchiya
Application Number:
JP2021561285A
Publication Date:
July 08, 2022
Filing Date:
November 12, 2020
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
H01L21/02
Domestic Patent References:
JP2010129600A
JP2001102425A
JP6176032A
JP2010225982A
JP2003173204A
JP2019197761A
Attorney, Agent or Firm:
Sakai International Patent Office