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Title:
COOLING DEVICE
Document Type and Number:
Japanese Patent JP2003021480
Kind Code:
A
Abstract:

To provide a cooling device of as small a size as possible, which efficiently and uniformly sinks heat emitted from a heat source.

The cooling device 1 is provided with a cooling unit 10 which is provided with; a hollow panel 11 accommodating therein a cooling medium and having an evaporating portion 11V, at the side of an endothermic surface 11a, for absorbing heat with the evaporation of the cooling medium, and a condensing portion 11C, at the side of an exhaust heat surface 11b, for emitting heat with the condensation of the cooling medium, while the endothermic surface 11a being confronted with a heat diffusing furnace H and being allowed to extend in the vertical direction; and a cooling jacket 12 which is disposed so as to face the surface 11b of the panel 11 and define a cooling channel 13 that confronts the surface 11b.


Inventors:
MATSUKI TERUYUKI
KADOTANI KANICHI
Application Number:
JP2001208190A
Publication Date:
January 24, 2003
Filing Date:
July 09, 2001
Export Citation:
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Assignee:
KOMATSU MFG CO LTD
International Classes:
F28D15/02; H01L21/22; H01L23/427; H01L23/473; (IPC1-7): F28D15/02; H01L21/22; H01L23/427; H01L23/473
Attorney, Agent or Firm:
Kimura Takahisa