Title:
COOLING STRUCTURE OF ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2015103537
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling structure of an electronic component which radiates heat generated in a ferrite core 12 in a more efficient manner.SOLUTION: A heat radiation structure radiates heat generated in a transformer 11 and has a heat transfer cooling plate 15 which contacts with a ferrite core 12 provided at the transformer 11. Slits 13a to 13d are respectively provided at four corner parts of the ferrite core 12. The heat transfer cooling plate 15 includes projection parts 21a to 21d inserted into the cutout parts 13a to 13d. The structure allows the heat generated in the ferrite core 12 to be efficiently radiated.
Inventors:
OKAZAKI FUMIHIRO
Application Number:
JP2013240558A
Publication Date:
June 04, 2015
Filing Date:
November 21, 2013
Export Citation:
Assignee:
CALSONIC KANSEI CORP
International Classes:
H01F27/24; H01F30/00; H05K7/20
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
Iwa Saki Kokuni
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu
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