Title:
冷却装置
Document Type and Number:
Japanese Patent JP7021582
Kind Code:
B2
Abstract:
To provide a cooling device that can improve cooling capacity for a cooling load while restraining an increase in size of the device.SOLUTION: A cooling device 100 comprises: a high-temperature side circuit 101 formed by connecting a compressor 10, a condenser 11, a main expansion valve 12, a subsidiary expansion valve 13, and a cascade heat exchanger; and a low-temperature side circuit 102 formed by connecting a compressor 20, the cascade heat exchanger, an expansion valve L1, and a cooling load L. The cascade heat exchanger comprises: a main cascade heat exchanger 3; and a supercooler 4 arranged in parallel with the main cascade heat exchanger 3 in the high-temperature side circuit 101, arranged downstream of the main cascade heat exchanger 3 in the low-temperature side circuit 102, and for cooling a liquid refrigerant condensed by the main cascade heat exchanger 3. The high-temperature side circuit 101 includes an auxiliary compressor 17 arranged in parallel with the main cascade heat exchanger 3 and arranged downstream of the supercooler 4.SELECTED DRAWING: Figure 1
Inventors:
Yoshinari Oda
Koji Takiguchi
Ishida Makoto
Mizuki Takano
Koji Takiguchi
Ishida Makoto
Mizuki Takano
Application Number:
JP2018061361A
Publication Date:
February 17, 2022
Filing Date:
March 28, 2018
Export Citation:
Assignee:
Fuji Electric Co., Ltd.
International Classes:
F25B7/00; F25B1/00; F25B5/02; F25B6/04; F25B40/02
Domestic Patent References:
| JP5896469U |
Foreign References:
| WO2016185568A1 |
Attorney, Agent or Firm:
Hirokazu Miyazono
Yusuke Tanaka
Yusuke Tanaka