Title:
COPPER TAPE CUTTING METHOD FOR COATED WIRE
Document Type and Number:
Japanese Patent JPH07274342
Kind Code:
A
Abstract:
PURPOSE: To provide a copper tape cutting method for coated wire in which unnecessary copper tape can be removed easily without causing any damage on the lower semiconductive layer while sustaining the sharpness of a cutter.
CONSTITUTION: At first, a vinyl sheath 16 and a cloth tape 14 are cut off and removed from a coated wire 2 to expose a copper tape 12. A fixing tape 18 is applied to the copper tape at a position separated by a specific length from the cut end of the vinyl sheath and then the copper tape is cut off at a position spaced apart from the fixing tape.
Inventors:
TAKAHASHI SEIICHI
MORI KENTARO
FUJII SHIGERU
MORI KENTARO
FUJII SHIGERU
Application Number:
JP5771594A
Publication Date:
October 20, 1995
Filing Date:
March 28, 1994
Export Citation:
Assignee:
HIGASHI NIPPON RYOKAKU TETSUDO
FURUKAWA ELECTRIC CO LTD
FURUKAWA ELECTRIC CO LTD
International Classes:
H02G1/12; (IPC1-7): H02G1/12; H02G1/12
Attorney, Agent or Firm:
Koji Nagato