Title:
COPPER WIRE AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2014210973
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a copper wire having a half-softening temperature lower than tough pitch copper (3N copper) and oxygen free copper (4N copper) and a tensile strength higher than high purity copper (6N copper), and a method for manufacturing the same.SOLUTION: The copper wire formed of a copper wire rod consisting of titanium of 5-55 massppm, sulfur of 3-12 massppm, oxygen of 2-30 massppm and the remainder of copper and inevitable impurities comprises: a first crystal having a crystal orientation [111] and including at least one of twin crystals in the crystal; and a second crystal being one or more crystals adjacent to the first crystal, having a crystal orientation [111] having a rotation angle on an atomic plane different from that of the first crystal and including at least one of twin crystals in the crystal.
Inventors:
AOYAMA MASAYOSHI
WASHIMI TORU
SAGAWA HIDEYUKI
FUJITO KEISUKE
GOTO MASAYOSHI
HIRUTA HIROYOSHI
WASHIMI TORU
SAGAWA HIDEYUKI
FUJITO KEISUKE
GOTO MASAYOSHI
HIRUTA HIROYOSHI
Application Number:
JP2014062834A
Publication Date:
November 13, 2014
Filing Date:
March 26, 2014
Export Citation:
Assignee:
HITACHI METALS LTD
International Classes:
C22C9/00; C22F1/02; C22F1/08; H01B1/02; H01B5/02; H01B13/00
Domestic Patent References:
| JP2011179110A | 2011-09-15 | |||
| JP2013057121A | 2013-03-28 | |||
| JP2012087377A | 2012-05-10 | |||
| JPS63211507A | 1988-09-02 | |||
| JP2008066108A | 2008-03-21 |