Title:
COPPERED LAMINATED PLATE
Document Type and Number:
Japanese Patent JPH08238713
Kind Code:
A
Abstract:
PURPOSE: To obtain a coppered laminated plate with excellent moisture-proofness and antisilver migration.
CONSTITUTION: Forty to eighty pts.wt. of melamine resin and 10 to 24 pts.wt. of epoxy resin are blended based on 100 pts.wt. of polyvinyl butylal. In addition, a copper foil is integrated with a base layer through an adhesive layer of at most 100ppm of metal ionic concentration in the polyvinyl butylal.
Inventors:
NARABE YOSHIYUKI
YANO MASABUMI
ISHIHARA HIDEKI
YANO MASABUMI
ISHIHARA HIDEKI
Application Number:
JP4603595A
Publication Date:
September 17, 1996
Filing Date:
March 07, 1995
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
B32B7/12; B32B15/08; B32B15/20; C09J129/14; C09J161/20; C09J161/28; C09J163/00; H05K3/38; (IPC1-7): B32B15/08; B32B7/12; B32B15/20; C09J161/28; C09J163/00
Attorney, Agent or Firm:
Hirose Akira