Title:
CREAM SOLDER
Document Type and Number:
Japanese Patent JPH07144292
Kind Code:
A
Abstract:
PURPOSE: To provide cream solder which does not sag at the time of printing and reflow and is good in both of printability and solderability.
CONSTITUTION: This cream solder is formed by intimately mixing powder solder and liquid or pasty flux and contains the N-substd. fatty acid amide expressed by the following general formula I and/or formula II as a thixotropic agent in the flux: R1CONHR2NHCOR1...I. R3NHCOR4CONHR3...II (where R1 denotes an aliphat. alkyl group, R2 denotes a hydrocarbon of diamine, R3 denotes an alkyl group of aliphat. amine, R4 denotes a hydrocarbon of a dicarboxylic acid.).
Inventors:
SHIMOKAWA KOICHI
SHIRAI TAKESHI
SASAKI YASUYUKI
WATANABE KATSUHIRO
MATSUI KENJI
KATSUOKA RITSU
UDONO NAOYASU
KATO KIYOSHI
TAKITA KAN
SHIRAI TAKESHI
SASAKI YASUYUKI
WATANABE KATSUHIRO
MATSUI KENJI
KATSUOKA RITSU
UDONO NAOYASU
KATO KIYOSHI
TAKITA KAN
Application Number:
JP31398993A
Publication Date:
June 06, 1995
Filing Date:
November 22, 1993
Export Citation:
Assignee:
SANEI KAGAKU KK
FUJITSU TEN LTD
KOKI KK
FUJITSU TEN LTD
KOKI KK
International Classes:
B23K35/22; B23K35/363; C08L93/00; C08L93/04; H05K3/34; (IPC1-7): B23K35/22; B23K35/363; C08L93/04; H05K3/34
Attorney, Agent or Firm:
Takeshi Shimizu