Title:
Cu-Co-Si BASED ALLOY SHEET OR STRIP FOR ELECTRONIC MATERIAL
Document Type and Number:
Japanese Patent JP2011246740
Kind Code:
A
Abstract:
To provide a copper alloy sheet or strip which when a lead frame is formed from the copper alloy sheet or strip, hardly causes deformation of the lead in the lead frame and achieves shortening of annealing time required for stress relieving after the lead frame is press worked.
The copper alloy sheet or strip for an electronic material has a composition containing, by mass, 0.4 to 3.0% Co and 0.09 to 1.0% Si, and the balance Cu with inevitable impurities, wherein the absolute value of the residual stress in a depth of 1 μm from the surface is ≤50 MPa, and also tensile strength is reduced by ≥40 MPa by heat treatment of performing heating at 500°C for 1 min.
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Inventors:
OKUBO MITSUHIRO
Application Number:
JP2010118530A
Publication Date:
December 08, 2011
Filing Date:
May 24, 2010
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C22C9/06; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22C9/10; C22F1/08; H01B1/02; H01B5/02; C22F1/00
Attorney, Agent or Firm:
Axis International Patent Business Corporation