Title:
CURABLE COMPOSITION, CURED PRODUCT, ITS MANUFACTURING METHOD AND LIGHT EMITTING DIODE ENCAPSULATED BY CURED PRODUCT
Document Type and Number:
Japanese Patent JP2004292714
Kind Code:
A
Abstract:
To provide a curable composition with good adhesion to various substrates and colorability under a high temperature condition and/or photoirradiation.
This curable composition comprises (A) an oreganopolysiloxane having 2 or more aliphatic unsaturated hydrocarbon radicals linked to a silicon atom in a molecule, (B) an organohydrogenopolysiloxane having 2 or more hydrogen atoms linked to a silicon atom in a molecule, (C) a hydrosilylation catalyst, (D) a silane coupling agent and/or an epoxy group-containing compound and (D) a boric acid ester as essential ingredients.
More Like This:
Inventors:
IWAHARA TAKANAO
OUCHI KATSUYA
OUCHI KATSUYA
Application Number:
JP2003089530A
Publication Date:
October 21, 2004
Filing Date:
March 28, 2003
Export Citation:
Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L83/07; C08K5/5415; C08K5/55; C08L83/05; H01L23/29; H01L23/31; H01L33/56; (IPC1-7): C08L83/07; C08K5/5415; C08K5/55; C08L83/05; H01L23/29; H01L23/31; H01L33/00