Title:
CURABLE COMPOSITION FOR INKJET, AND CURED COATING FILM AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2017066302
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a curable composition for inkjet having various characteristics such as solder heat resistance and gold plating durability as well as good adhesiveness to a base and having high hardness after cured and a low viscosity suitable for inkjet printing, and a cured coating film and a printed wiring board using the composition.SOLUTION: The curable composition for inkjet comprises (A) a urethane (meth)acrylate resin, (B) a photopolymerization initiator, (C) a bifunctional (meth)acrylate compound, and (D) an epoxy (meth)acrylate resin having at least one (meth)acryloyl group.SELECTED DRAWING: None
Inventors:
YOSHIKAWA RINA
SHIMURA MASAYUKI
MATSUMOTO HIROSHI
SHIMURA MASAYUKI
MATSUMOTO HIROSHI
Application Number:
JP2015194912A
Publication Date:
April 06, 2017
Filing Date:
September 30, 2015
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
C09D11/30; C08F290/06; H05K3/28
Domestic Patent References:
| JP2012162688A | 2012-08-30 | |||
| JPH09504752A | 1997-05-13 | |||
| JP2009271290A | 2009-11-19 | |||
| JP2015089903A | 2015-05-11 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro